SECO Presentación Soluciones Alto Rendimiento con Intel 8ª Gen Core U y 9ª Gen Core H

En tándem con propio release de Intel, SECO introduce portfolio de solutions powered by Intel's newest silicon: la 8ª-Generation Core U family (codenamed Whiskey Lake) y la 9ª-Generation Core H family (codenamed Coffee Lake Refresh).

La 8th-Gen Core U series entrega rich feature sets y impressive performance-per-watt. Con opciones ranging from dual- a quad-core configurations, enhanced I/O bandwidth y DDR4-2400 memory support, estos processors satisfacen growing demands para graphics, audio y compute, mientras leaving room to consolidate data y applications. Optimized software tools como Intel's Distribution of OpenVINO y Intel System Studio accelerate development de vision applications —facial recognition, people counting, object detection.

Para translate this potential into ready-made form factor, SECO engineered el COMe-C55-CT6, un COM Express 3.0 Compact Type 6 module built around 8th-Gen Core y Celeron U-series. Ofrece extensive connectivity —4× USB 3.1, 8× USB 2.0 y up to 8× PCI-e ×1 lanes— y ships con Intel UHD Graphics 620 y dos DDR4 SO-DIMM slots supporting DDR4-2400 up to 32 GB. Leveraging su low-power, multi-core architecture, el COMe-C55-CT6 es ideal para biomedical y medical devices, edge computing, digital signage & infotainment, HMI kiosks, transportation y precision instruments.

La 9th-Gen Core H series representa Intel IoT's most powerful y flexible 45-W class processors yet. Supporting Intel's Distribution of OpenVINO y Intel Media SDK, los 4- a 6-core chips proporcionan expanded I/O bandwidth y DDR4-2666 memory, delivering throughput required para run multiple workloads y serve as foundation para intelligent devices y value-added solutions.

SECO responds to market demands by building a COM Express solution y un Single-Board Computer en mini-ITX form factor en estos cutting-edge processors.

El COMe-C08-BT6 es un COM Express 3.0 Basic Type 6 module que now supports Intel 8th-Gen Core/Xeon y 9th-Gen Core/Xeon/Pentium/Celeron CPUs. Con hasta seis cores, el módulo delivers unrivaled processing power. Incorpora Intel Gen 9 LP graphics core con hasta 48 execution units, 4× USB 3.0, 8× USB 2.0, 8× PCI-e ×1 Gen 3 y PEG ×16 Gen 3 interface. Dual SO-DIMM slots accommodan hasta 64 GB DDR4-2666 (including ECC con Xeon y Core i3 + CM246 PCH). Esta plataforma excels en biomedical/medical devices, digital signage & infotainment, gaming, telco, HMI y industrial automation/control.

Para those preferring single-board computer, SECO ofrece el SBC-C66-mITX —un mini-ITX SBC powered by Intel 8th-Gen Core/Xeon y 9th-Gen Core/Xeon/Pentium/Celeron CPUs. El board presume robust graphics con Intel UHD Graphics 630/P630, supporting hasta tres independent displays simultaneously, y multiple video outputs (2× DP++, eDP 40-pin, LVDS/S/D channel). Connectivity es comprehensive: 2× Gigabit Ethernet con AMT, IEEE 1588 y TSN via Intel I210, 2× USB 3.1, 4× USB 2.0, NVMe SSD slot, PCI-e ×8 port (mechanical ×16) y VPU High-Speed Connector con 4× USB 3.1 y 2× PCI-e ×4. Memory slots hold hasta 128 GB DDR4 en 4× SO-DIMM (ECC supported). Ideal para biomedical/medical devices, gaming, industrial automation/control, IIoT y surveillance —SECO's high-performance, flexible edge solution.